Google Pixel 11 Specs & Tensor G6 Price Leaks Out
Comprehensive leaks reveal full hardware specifications, TSMC 3nm Tensor G6 benchmarks, and pricing details for the upcoming Google Pixel 11 lineup.
Supply Chain Details Confirm TSMC 3nm Tensor G6 Architecture
Detailed hardware specifications and launch pricing for Google's next-generation Pixel 11 family have leaked via supply chain documentation. The release encompasses four models, including standard, Pro, Pro XL, and foldable variants.
All devices in the lineup feature the new Tensor G6 application processor fabricated on TSMC's 3nm node, yielding substantial improvements in thermal efficiency and battery endurance.
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Pricing Breakdown Across Standard, Pro, and Foldable Form Factors
By maintaining competitive entry pricing despite advanced silicon upgrades, Google aims to strengthen its market position ahead of autumnal mobile device announcements.