Pixel 11 Pro Fold CAD Designs Leak Ahead of Google August Event

Detailed factory CAD renders of Google's upcoming Pixel 11 Pro Fold have surfaced online ahead of the company's scheduled hardware launch event. The leaked schematics showcase a significantly thinner chassis when folded, alongside a redesigned camera module.

The leaks indicate that Google has re-engineered the inner display hinge, reducing the visible crease while achieving an IPX8 water resistance rating. Developers crafting mobile viewport layouts can use [JSON to YAML Converter](/tools/json-to-yaml/) to check mobile UI configuration files.

Ultra-Slim Hinge Mechanism and Reduced Display Crease

The flagship foldable is expected to be powered by Google's next-generation Tensor G6 processor, built on a 3nm node for improved thermal efficiency and faster on-device AI model inference.

Tensor G6 Chipset and Enhanced On-Device AI Features

Google is expected to officially announce the Pixel 11 Pro Fold alongside the Pixel 11 smartphone lineup next month.